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3M Thermally Conductive Silicone Interface Pad 5514 3M Thermally Conductive Silicone Interface Pad 5514 3M Thermally Conductive Silicone Interface Pad 5514
3M Thermally Conductive Silicone Interface Pad 5514
3M Thermally Conductive Silicone Interface Pad 5514 3M Thermally Conductive Silicone Interface Pad 5514

3M Thermally Conductive Silicone Interface Pad 5514

0.00 INR/Sheet

Product Details:

  • Product Type Thermal Pad
  • Material Other
  • Size 0.25T X 45MM X 20M
  • Width 45MM Millimeter (mm)
  • Thickness 0.25 Millimeter (mm)
  • Application Heat Management of Electronic Devices
  • Length 20M Meter (m)
  • Supply Ability : 100 Sheet Per Day
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Price And Quantity

  • 0.00 INR/Sheet
  • 5 Sheet

Product Specifications

  • Soft
  • Gray
  • 20M Meter (m)
  • Heat Management of Electronic Devices
  • Good thermal conductivity (1.6 W/m-K)
  • 0.25 Millimeter (mm)
  • High temperature resistance
  • Thermal Pad
  • 0.25T X 45MM X 20M
  • Transparent
  • Other
  • 45MM Millimeter (mm)

Trade Information

  • Faridabad
  • Cheque, Cash in Advance (CID), Cash Advance (CA), Cash on Delivery (COD)
  • 100 Sheet Per Day
  • 4 Days
  • Yes
  • Sample costs shipping and taxes has to be paid by the buyer
  • Carton Packaging
  • All India

Product Description

3M Thermally Conductive Silicone Interface Pad 5514 

 3M Thermally Conductive Silicone Interface Pad 5514 (0.25T X 45MM X 20M )Roll

3M Thermally Conductive Silicone Interface Pad 5514 is a silicone elastomer sheet, designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders and other cooling devices. 

Features and Benefits 

  • Good thermal conductivity (1.6 W/m-K) 
  • Good converting for complicated shape 
  • Hardness: Shore 00 = 58
  • Good flexibility with over bending
  • Good dielectric properties 
  • Thin thickness, 0.20 mm and 0.25 mm 
  • UL 94 V-1  Roll is available
  • High temperature resistance

Product Uses :-This product can be used for heat management of electronic devices and joining/stacking parts in electronic components.

Application Ideas 

  • IC Packaging Heat Conduction 
  • COF Chip Heat Conduction 
  • Printed Circuit Board
  • LED Board TIM 
  • Spacer for Battery Module/Pack
  • HD TV Address IC Chip and Scan Module 
  • Heat Sink by Aluminum, other metal and ceramic
  •  Thin Gap Filling between board, module and chassis Mechanical fastening such as clamp, bracket, screw and additional tapes and adhesives bonding can be used in parallel with this pad.


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