3M Thermally Conductive Silicone Interface Pad 5519

Product Description

3M Thermally Conductive Silicone Interface Pad (TCSIP)5519 comes in gray color, 16 v/mm dielectric strength, 3.1 W/m-k thermal conductivity and other technical specifications. The offered product is ideal to be used in a battery and led lighting thermal management system. Finds application in thermal interface damping cushioning, this pad has good wettability for better thermal conductivity. In addition to this, the provided Thermally Conductive Silicone Interface Pad 3m incorporates a thin polymeric film carrier to improve handling and a non-tacky surface for ease of rework.

Features of 3M  Pad  5519:-

• Very high thermal conductivity and good electrical insulation properties
• Good softness and conformability even to non-flat surfaces
• Good electrical insulation properties
• Good flame retardant, UL94 V-0 equivalent material
• Compression relaxation properties help reduce pressure to electric components
  

• Integrated chip (IC) packaging heat conduction
• Heat sink interface Chip on film (COF) heat conduction
• LED board thermal interface material (TIM)
• HDTV integrated chip (IC)
• General gap filling in electronic device.